Friction riveting of FR4 substrates for printed circuit boards: Influence of process parameters on process temperature development and joint properties

This work investigates the influence of Friction Riveting processing conditions on FR4-PCB substrate/AA2024 rivet joints in terms process temperature evolution, joint formation, and physical-chemical mechanical properties. The were manufactured using 4 mm diameter AA-2024-T3 rivets FR4 laminates 1.5 thickness with single or double copper-clad layers. evolution was recorded substrate surface correlated resulting formation. Most obtained copper clad layers developed temperatures above 300 °C, whereas produced a presented slightly lower temperatures, but still 250 °C. Rivet anchoring achieved for both material combinations configuration single-base laminate, as well two even three overlapped laminates. Thermogravimetric analyses revealed that °C intensive thermal degradation occurs materials (with 30% mass change), followed by decomposition, non-uniform heat distribution throughout thickness. ultimate tensile force higher within more than one showing efficiency.